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Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Heat dissipation from three-dimensional (3D) chip stacks can cause large thermal gradients due to the accumulation of dissipated heat and thermal interfaces from each integrated die. To reduce the overall thermal resistance ...
Erratum: “Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks” [ASME J. Electron. Packag., 2016, 138(4), p. 041009; DOI: 10.1115/1.4034927]
Publisher: The American Society of Mechanical Engineers (ASME)